ENGINEERING PROPERTIES OF MSW LANDFILL DAILY COVERS USING WASTE TIRE CHIPS AND PAPER SLUDGE

The use of earth materials as daily covers not only consumes valuable landfill

space, but also brings a series of operating issues such as fine migration and hetergenity of waste

mass. In this study, a mixture of paper sludge and waste tire chips was proposed for daily cover

applications in MSW landfills. The engineering properties of the individual tire chips, the sludge,

as well as their mixture, were evaluated in this study in terms of the index properties, hydraulic

conductivity, and shear resistance of the materials. When compared to traditional soil covers, the

proposed cover material was found to be lighter in weight, more impermeable and higher in

shear resistance. It was also found that with the addition of tire chips to the paper sludge, the

shear strength of the mixture improved considerably. The results suggest that the proposed

material has mechanical characteristics that are desirable to be a landfill daily cover.

Check Also

Recycled waste made up 11.8% of materials used in EU last year

Highest circularity rate seen in Netherlands at 30.6%, lowest in Romania at 1.3%, says Eurostat …

Deixe um comentário

O seu endereço de e-mail não será publicado. Campos obrigatórios são marcados com *